Baird notes supply chain talk of Intel fab spinoff with TSMC Baird analyst Tristan Gerra says there are discussions from the Asia semiconductor supply chain that the U.S. government will get involved in potentially TSMC (TSM) sending engineers to Intel’s (INTC) 3nm/2nm fab, applying the company’s know-how to ensure that fab and subsequent manufacturing projects from Intel become viable. In addition, Intel’s fab could be spun off into a new entity jointly owned by TSMC and Intel, and run by TSMC, with the new entity receiving U.S. Chip Act funding, the firm adds. Baird says that while there is no confirmation and potential completion of this proje
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